The application and development of boron nitride in the field of thermal conductive fillers

Release time:

2024-12-28

Boron nitride, as a currently very high thermal conductivity insulating thermal conductive material, plays an irreplaceable role in improving the thermal conductivity of polymer matrix.

With the continuous development of technology, the functions of electronic devices are becoming increasingly powerful, accompanied by the problem of a sharp increase in heat generation. To ensure the stable operation of electronic devices, heat dissipation has become one of the challenges that need to be addressed. Insulating thermally conductive polymer-based composites are materials that can still transfer heat while in an electrically insulating state, allowing the material to maintain insulation performance while possessing excellent thermal conductivity. They can effectively dissipate the heat generated by electronic devices, preventing overheating and extending their lifespan.

In the field of heat exchange engineering, the application of insulating thermally conductive polymer-based composites is particularly prominent. Due to their excellent thermal conductivity, they can effectively transfer heat from one place to another, greatly improving the efficiency of heat exchange. This not only reduces energy waste but also provides a more stable and reliable working environment for various thermal equipment.

In the aerospace field, insulating thermally conductive polymer-based composites also shine. It is well known that aerospace vehicles generate a large amount of heat during high-speed flight, and if this heat is not handled in a timely and effective manner, it can seriously affect the performance and safety of the entire aircraft. The emergence of insulating thermally conductive polymer-based composites provides strong support for solving this problem, ensuring the normal operation of spacecraft.

In addressing the heat dissipation issues of the new generation of high-power, highly integrated, and smaller electronic products, the method of adding thermally conductive fillers to improve the thermal conductivity of polymer matrices has become the mainstream solution. As thermally conductive fillers, they should meet the following basic requirements: 1. High thermal conductivity; 2. No reaction with the polymer matrix; 3. Good chemical and thermal stability. Boron nitride, with its excellent thermal conductivity, has become a widely used insulating thermal conductive material.

Hexagonal boron nitride is an advanced ceramic material that appears in a flaky form at the microscopic level, with a molecular structure of hexagonal crystals. Hexagonal boron nitride has very special and excellent physicochemical properties, including very good thermal conductivity, electrical insulation, chemical corrosion resistance, and oxidation resistance, with a temperature tolerance of up to 1000°C in air and even up to 2000°C in inert gases and vacuum.

Boron nitride has very good thermal stability, maintaining stable thermal conductivity at high temperatures. In addition, its insulation performance is excellent, effectively preventing the loss of electrical performance. Due to these unique properties, boron nitride plays a crucial role in enhancing the thermal conductivity of polymer matrices.

By adding boron nitride, the thermal conductivity of the polymer matrix is significantly improved, effectively reducing the temperature of electronic devices during operation. Furthermore, another notable advantage of boron nitride is its ease of mixing with polymer matrices, allowing for uniform distribution within the matrix, thereby enhancing the thermal conductivity of the entire material.

As a currently highly thermally conductive insulating material, boron nitride plays an irreplaceable role in improving the thermal conductivity of polymer matrices. Its widespread application indicates a new direction for the heat dissipation technology of future electronic products, providing effective solutions for the heat dissipation issues of the new generation of high-power, highly integrated, and smaller electronic products.

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